Low Pressure Overmolding

When encapsulating highly sensitive electronic assemblies that require
environmental protection, low pressure molding offers a
superior solution to traditional highpressure overmolding.

What Is Low Pressure Overmolding?

Low pressure overmolding is a process that injects thermoplastic material at low pressure (~100 PSI) and lower temperatures into a custom mold. The material flows around and bonds to cable jackets, connectors, and electronic components, then quickly solidifies to create a durable, sealed, ingress-protected assembly.

Common applications include:

  • PCB assemblies
  • Sensors
  • Connector back shells
  • Cable to connector transitions

Benefits of Materials Used in Low Pressure Overmolding

Low pressure injection overmolding commonly uses thermoplastic materials such as polyamide (PA) and polyolefin (PO)-based hot melts. These materials are engineered to:

  • Bond to common cable jacket materials
  • Provide strong moisture resistance
  • Improve vibration resistance
  • Maintain flexibility in demanding environments

 

Material selection for thermoplastic overmolding is driven by the components being molded, performance requirements, including temperature exposure, chemical resistance, mechanical stress, and/or ingress protection targets.

Our in-house engineering team evaluates these factors early in the design phase to meet your needs.

Designed for Production

MJM Industries supports low pressure overmolding projects from concept through full production. We collaborate early to: 

  • Review part geometry, material selection, and moldability 
  • Recommend design adjustments for manufacturability 
  • Develop custom tooling 
  • Provide first articles 
  • Validate performance through testing 


Because tooling, molding, and assembly are managed under one roof, we maintain tight process control and deliver consistent, repeatable quality across production runs.

When to Choose Low Pressure Overmolding

Low pressure overmolding delivers the benefits of traditional overmolding while protecting sensitive components from high heat and pressure.
It provides:
 

  • Ingress protection 
  • Encapsulation and protection for sensitive electronics 
  • A scalable alternative to manual potting 
  • Precise part detail of a traditional injection molded part without the harsh processing requirements 

 

If you are evaluating potting versus low pressure injection overmolding, MJM Industries can help you compare tooling investment, expected volumes,
and long-term cost structure to determine the most practical and scalable solution.
 

Partner With MJM Industries

Contact MJM Industries today to discuss your low pressure overmolding requirements and determine
whether this process is the right fit for your application.